Dual purpose retaining ring and polishing pad conditioner

Details Dual purpose retaining ring and polishing pad conditioner Dual purpose retaining ring and polishing pad conditioner

1997-07-17

1999-12-21

Morgan, Eileen P.

Abrading

Machine

Rotary tool

451 56, 451443, 451288, B24B 500

Patent

active

060041935

ABSTRACT:
An apparatus is provided for conditioning a polishing pad used for chemical-mechanical polishing. The apparatus comprises the retainer ring used to retain the semiconductor wafer against the polishing pad. Accordingly, the retainer ring serves a dual purpose: to retain the wafer in proper CMP position as well as condition the polishing surface while polishing of the wafer. The retainer ring includes an inner surface defining an opening to receive the semiconductor wafer. Dimensioned radially outside the inner surface is an outer surface. Placed on the distal ends between the inner and outer surfaces is an abrasive surface. The abrasive surface extends along a plane parallel to the retained frontside surface of the wafer. Both the wafer and the abrasive surface contact the polishing surface either in a rotation about a stationary axis or orbital movement about that axis. The wafer surface can be pressed to a greater or lesser extent against the polishing pad independent of the pressure exerted by the abrasive surface on that pad radially outside the wafer.

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