Dual pulsed beam laser micromachining method

Details Dual pulsed beam laser micromachining method Dual pulsed beam laser micromachining method

2005-05-05

2009-11-03

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C257SE23194

Reexamination Certificate

active

07611966

ABSTRACT:
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser melts portions of the workpiece prior to a second laser ablating the portions of the workpiece.

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