Dual power supply method and apparatus

Details Dual power supply method and apparatus Dual power supply method and apparatus

2005-02-08

2005-02-08

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S678000, C257S684000, C257S693000

Reexamination Certificate

active

06853061

ABSTRACT:
The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.

REFERENCES:
patent: 5556811 (1996-09-01), Agatstein et al.
patent: 5980267 (1999-11-01), Ayers et al.
patent: 6369444 (2002-04-01), Degani et al.
patent: 20030198033 (2003-10-01), Panella et al.

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