Dual-pitch perimeter flip-chip footprint for high integration as

Details Dual-pitch perimeter flip-chip footprint for high integration as Dual-pitch perimeter flip-chip footprint for high integration as

1999-05-28

2000-03-14

Gaffin, Jeffrey

Electrical transmission or interconnection systems

Plural supply circuits or sources

361772, 361805, H02J 100

Patent

active

060376775

ABSTRACT:
A connection array for a chip provides a substantial increase in numbers of signal connection locations and a power distribution arrangement of improved robustness and noise immunity while accommodating multiple power supply voltages by providing pairs of sub-arrays aligned with chip edges and signal connection locations formed in columns orthogonal to a chip edge or segment of the chip perimeter. Signal connections in a column are spaced at a first pitch and columns of signal connections are spaced at a second pitch. Power connections corresponding to different power supply voltages are provided between columns of signal connections and along rows which are centered between rows of signal connections generally parallel to an edge of a chip. Power distribution layers may be formed as a mesh which extends in under the chip in alignment with power connections to the chip and beyond the perimeter of the chip, as well to provide multiple low-impedance power delivery paths to improve noise immunity. The connection pattern allows fewer layers of redistribution wiring to be used to escape the chip, reducing overall product cost. Thus improvements in functionality and performance can be supported at reduced cost, particularly for custom designed application specific integrated circuits.

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