Dual pitch contact pad footprint for flip-chip chips and...

Details Dual pitch contact pad footprint for flip-chip chips and... Dual pitch contact pad footprint for flip-chip chips and...

2007-03-27

2007-03-27

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

10455982

ABSTRACT:
An electronic device, including: a plurality of contacts pads on a surface of a substrate; the contacts pads spaced apart a first predetermined distance in a first direction; and the contact pads spaced apart a second predetermined distance in a second direction, the first predetermined distance different from the second predetermined distance, the first direction perpendicular to the second direction.

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