Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2008-05-13
2008-05-13
Punnoose, Roy M (Department: 2886)
Optics: measuring and testing
Dimension
Thickness
C356S632000
Reexamination Certificate
active
07372584
ABSTRACT:
A measurement system for measuring aspects of a wafer combines an apparatus for performing a conductivity measurement, such as a four-point probe system, with apparatus for performing an optical measurement, such as a photoacoustic measurement system. Results are obtained and combined to provide comprehensive data sets describing the characteristics of the thin film substrate therein.
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Harrington & Smith PC
Punnoose Roy M
Rudolph Technologies, Inc.
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