Dual pattern microprocessor package footprint

Details Dual pattern microprocessor package footprint Dual pattern microprocessor package footprint

1994-07-22

1996-09-17

Thomas, Laura

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361760, 174260, 174261, 29832, 257797, 257792, H05K 118

Patent

active

055575056

ABSTRACT:
A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

REFERENCES:
patent: 4530002 (1985-07-01), Kanai

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