Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment
Reexamination Certificate
2007-07-24
2007-07-24
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
With work or work parts movable during treatment
C134S034000, C134S036000, C134S902000
Reexamination Certificate
active
10461068
ABSTRACT:
An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.
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Finlay Robert Boyd
Robertson Gary
Barr Michael
Beyer & Weaver, LLP
Chaudhry Saeed T.
National Semiconductor Corporation
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