Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2011-01-18
2011-01-18
Geyer, Scott B (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
Reexamination Certificate
active
07872343
ABSTRACT:
An interconnect structure (i.e., an interposer) which is mounted and electrically connected to a bottom semiconductor package substrate either prior or subsequent to such bottom substrate being populate with one or more electronic components. Subsequently, a top semiconductor package substrate which may also be populated with one or more electronic components is mounted to the interposer, such that all of the electronic components are disposed between the top and bottom interposers. Thereafter, a suitable mold compound is injected between the top and bottom substrates, the mold compound flowing about the electronic components, between the BGA joints, and at least partially about the interposer, thus helping to lock the interposer in place in the completed semiconductor package.
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Amkor Technology Inc.
Geyer Scott B
Stetina Brunda Garred & Brucker
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