Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-08-07
2007-08-07
Nguyen, Cuong (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C257S679000, C257S724000
Reexamination Certificate
active
10514436
ABSTRACT:
The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
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Kim Jung Ho
Yu Hong Jun
Clark Hill PLC
JT Corp.
Nguyen Cuong
LandOfFree
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