Dual inductance structure

Details Dual inductance structure Dual inductance structure

2009-04-22

2010-10-05

Mai, Anh T (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S223000, C336S232000

Reexamination Certificate

active

07808357

ABSTRACT:
A dual inductance structure including a substrate, a first inductance element, a second inductance element and a grounding element is provided. The substrate has a layout layer and a grounding layer. The first inductance element has a first and a second conductor. The second inductance element has a third and a fourth conductor. The grounding element has a first and a second grounding portion. The first grounding portion is on the grounding layer and located at an area between the first conductor and the third conductor. At least a part of the second grounding portion is on the grounding layer and located at an area between the first conductor and the second conductor. At least another part of the second grounding portion is on the grounding layer and located at an area between the third conductor and the fourth conductor.

REFERENCES:
patent: 6404319 (2002-06-01), Iida et al.
patent: 6577219 (2003-06-01), Visser
patent: 6798326 (2004-09-01), Iida
patent: 7227428 (2007-06-01), Fukunaga
patent: 7321284 (2008-01-01), Chen et al.
patent: 7518473 (2009-04-01), Ni
patent: 7538652 (2009-05-01), Jenkins et al.
patent: 7602264 (2009-10-01), Itou et al.
patent: 2007/0013462 (2007-01-01), Fan

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