Dual in-line packaging and method of producing the same

Details Dual in-line packaging and method of producing the same Dual in-line packaging and method of producing the same

1992-04-28

1993-06-15

Thomas, Tom

Fishing, trapping, and vermin destroying

437209, 437215, 437217, H01L 2160

Patent

active

052197956

ABSTRACT:
A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.

REFERENCES:
patent: 3911475 (1975-10-01), Szedon et al.
patent: 4001655 (1977-01-01), Voyles et al.
patent: 4540603 (1985-09-01), Hidaka et al.
patent: 4717948 (1988-01-01), Sakai et al.
patent: 4731644 (1988-03-01), Neidig
patent: 4758875 (1988-07-01), Fujisaki et al.
patent: 4784872 (1988-11-01), Moeller et al.
patent: 4803543 (1989-02-01), Inayoshi et al.
patent: 4822536 (1989-04-01), Voinis et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5034350 (1991-07-01), Marchisi

Affiliated with

Also associated with

Rating

Dual in-line packaging and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual in-line packaging and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual in-line packaging and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1042381