Dual in-line package with window frame

Details Dual in-line package with window frame Dual in-line package with window frame

1975-01-30

1977-05-24

Reynolds, Bruce A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29627, H05K 506

Patent

active

040257169

ABSTRACT:
An integrated circuit package having a lead frame positioned between two lead glass layers on a ceramic base and a ceramic window frame bonded to the lead glass for accommodating a cap attached by a glass to gold to gold-tin eutectic bond. The various layers are applied by an advantageous combination of screen printing and fusing steps.

REFERENCES:
patent: 3404319 (1968-10-01), Tsuji et al.
patent: 3435516 (1969-04-01), Kilby
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3502786 (1970-03-01), Stoll
patent: 3509430 (1970-04-01), Mroz
patent: 3535486 (1970-10-01), Wood
patent: 3537175 (1970-11-01), St. Clair et al.
patent: 3698073 (1972-10-01), Helda
patent: 3793064 (1974-02-01), Budd et al.
patent: 3809797 (1974-05-01), McMunn et al.

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