Dual in-line package carrier assembly

Details Dual in-line package carrier assembly Dual in-line package carrier assembly

1984-04-23

1987-01-20

McQuade, John

Geometrical instruments

339 17CF, 339 75MP, H01R 13635

Patent

active

046376704

ABSTRACT:
DIP carrier assembly comprises carrier having support surface with apertures therethrough to channels in side and bottom of carrier into which DIP leads are formed. Terminals aligned in channels in opposed sidewalls of socket apply releasing force on carrier when DIP leads deflect contact portions of terminals. Release of resilient latch on socket causes ejection of carrier.

REFERENCES:
patent: 3883207 (1975-05-01), Tomkiewicz
patent: 4420207 (1983-12-01), Nishikawa
patent: 4490001 (1984-12-01), Gordon et al.

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