Dual-in-line package carrier and socket assembly

Geometrical instruments

Patent

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Details

339176MP, H01R 1324

Patent

active

043547184

ABSTRACT:
The present invention discloses a protective carrier for a dual-in-line package (DIP) and a socket which receives the loaded carrier to electrically connect the leads on the DIP to circuits on a printed circuit board (PCB). More particularly, the protective carrier comprises a frame into which the DIP is secured. The socket consists of a housing with a row of contact terminals on each side. The carrier slides down over the housing whereby leads on the DIP within the carrier make contact with the terminals.

REFERENCES:
patent: 3345541 (1967-10-01), Cobaugh et al.
patent: 3409861 (1968-11-01), Barnes et al.
patent: 3480902 (1969-11-01), Barnes et al.
patent: 3529277 (1970-09-01), Barnes
patent: 3784960 (1974-01-01), Bruckner
patent: 3796921 (1974-03-01), Fischer
patent: 3825876 (1974-07-01), Damon
IBM Bulletin, Morgan et al., Joining Dip Modules 12-1968, vol. 11, No. 7, pp. 736 and 737.

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