Dual-in-line package assembly

Details Dual-in-line package assembly Dual-in-line package assembly

1981-07-02

1983-09-27

McQuade, John

Geometrical instruments

339 17CF, H01R 2368

Patent

active

044065086

ABSTRACT:
A dual-in-line package assembly for interconnection with a printed circuit board includes a base having a plurality of free-standing contacts and a DIP carrier having channels extending therethrough for jointly receiving DIP lead and base contacts and for biasing resililent portions of the base contacts upon the DIP leads interiorly of the carrier. The channels of carriers stacked in the assembly have common base contacts passing therethrough in registry with a lead of each stacked package.

REFERENCES:
patent: 3605062 (1971-09-01), Tinkelenberg et al.
patent: 3611269 (1971-10-01), Reed
patent: 3846734 (1974-11-01), Pauza et al.
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4045105 (1977-08-01), Lee et al.
patent: 4080026 (1978-03-01), Gianni
patent: 4116518 (1978-09-01), Pleskac
patent: 4116519 (1978-09-01), Grabbe et al.
patent: 4356532 (1982-10-01), Donaher et al.
patent: 4364620 (1982-12-01), Mulholland et al.

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