Dual heat sink assembly for cooling multiple electronic modules

Details Dual heat sink assembly for cooling multiple electronic modules Dual heat sink assembly for cooling multiple electronic modules

1998-02-09

1999-11-02

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257718, 361710, 361715, 361719, H05K 720

Patent

active

059782234

ABSTRACT:
An assembly is provided for cooling a plurality of electrical modules mounted on the top and bottom surfaces of a circuit board. The circuit board includes an array of vias extending between the top and bottom surfaces of the circuit board. Each electrical module includes a plurality of leads, each lead being attached to a conductive region on the surface of the circuit board connected to one of the vias. The assembly of the invention includes a first metal heat sink and a second metal heat sink on opposite sides of the circuit board, each aligned with the multiple modules. A plurality of mounting elements attaches the first and second heat sinks together. A respective one of a pair of thermally conductive elements contacts the top surface of each electrical module and a respective heat sink for conducting heat from the modules to the heat sinks. A push pin assembly is used for mounting the first and second heat sinks together.

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U.S. application No. 08/915,059, Filed Aug. 20, 1997, Entitled Heat Sink Assembly For Cooling Electronic Modules, by Butterbaugh et al., IBM Docket No. (RO997-098).
Brochure entitled "T-flex 200 Series" by Thermagon, Inc. No Known date.

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