Dual diode module with heat sink, for use in a cavity power comb

Details Dual diode module with heat sink, for use in a cavity power comb Dual diode module with heat sink, for use in a cavity power comb

1984-02-13

1987-08-25

LaRoche, Eugene R.

Oscillators

Plural oscillators

Parallel connected

331 96, 331107P, 331107C, 357 81, 333250, H03B 2700, H01L 2312

Patent

active

046895833

ABSTRACT:
A composite diode module is provided having an impedance matching member integrally formed within the module. The module includes a base member, a heat sink holder member having an aperture, a gold plated diamond heat sink which is disposed in the aforementioned aperture, and an encapsulant holder member having a second aperture. IMPATT diodes are disposed in dielectric spacers bonded to one end of the heat sink in alignment with the second aperture. A bias pin member is then bonded on the second end of the IMPATT and an encapsulant having selected electrical properties is provided in the second pair of apertures to secure the diode and to provide the diode module with a predetermined impedance characteristic. In a preferred embodiment, the module includes a pair of IMPATT diodes. With this arrangement, the module may be used in power combiners.

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Russell, E. M., Thomson, I.; "Embedded Diamond Heat Sinks for Avalanche Diode"; Proceeding of the IEEE, Aug. 1972; pp. 1014-1015.
Magao, H and Katayama, S.; "Silicon IMPATT Diode Device Incorporating a Diamond Heat Sink"; NEC Research & Development; No. 35, Oct. 1974, pp. 67-76.
"Improved Performance of Silicon Avalanche Oscillators Mounted on Diamond Heat Sinks", C. B. Swan, Proceedings of the IEEE, Sep. 1967, pp. 1617-1618.

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