Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2002-02-07
2008-03-04
Landau, Matthew C. (Department: 2815)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S096000
Reexamination Certificate
active
07338833
ABSTRACT:
A structure and method for suppressing lateral leakage current in full fill factor image arrays includes dual dielectric passivation layer. A first passivation layer includes a material that is an insulator, has a low dielectric constant to minimize capacitive coupling between the contacts, and is low stress to prevent cracking. A second passivation layer includes a thin oxide or nitride layer over the first passivation layer.
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Boyce James B.
Lemmi Francesco
Lu Jeng Ping
Mei Ping
Street Robert A.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Landau Matthew C.
Xerox Corporation
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