Dual cure epoxy backseal formulation

Details Dual cure epoxy backseal formulation Dual cure epoxy backseal formulation

1994-08-14

1996-08-20

Chapman, Mark

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

522 25, 522170, C08F 246

Patent

active

055477135

ABSTRACT:
A photocopolymerizable composition for backsealing a ceramic carrier and process for using the composition is disclosed. The composition comprises: a liquid, multifunctional, bisphenol based epoxy; a liquid, multifunctional hydroxyl containing organic material; a complex onium salt photoinitiator; and, a complex cupric salt initiator. The composition utilizes a strong Bronstead acid for additional deep curing created by iodonium salt thermolysis.

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patent: 5202061 (1993-04-01), Angelopoules

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