Dual cure epoxy backseal formulation

Details Dual cure epoxy backseal formulation Dual cure epoxy backseal formulation

1996-03-19

1998-06-30

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525523, 525533, 522 25, 522 26, 522 27, 522 29, C08F 2000

Patent

active

057735280

ABSTRACT:
A photocopolymerizable composition for backsealing a ceramic carrier and process for using the composition is disclosed. The composition comprises: a liquid, multifunctional, bisphenol based epoxy; a liquid, multifunctional hydroxyl containing organic material; a complex onium salt photoinitiator; and, a complex cupric salt initiator. The composition utilizes a strong Bronstead acid for additional deep curing created by iodonium salt thermolysis.

REFERENCES:
patent: 4048356 (1977-09-01), Bakos et al.
patent: 4058401 (1977-11-01), Crivello
patent: 4173551 (1979-11-01), Crivello
patent: 4225691 (1980-09-01), Crivello
patent: 4256828 (1981-03-01), Smith
patent: 4287228 (1981-09-01), Schlesinger
patent: 4289595 (1981-09-01), Tortorello
patent: 4308118 (1981-12-01), Dudgeon
patent: 4318766 (1982-03-01), Smith
patent: 4351708 (1982-09-01), Berner et al.
patent: 4374751 (1983-02-01), Dudgeon
patent: 4378277 (1983-03-01), Smith
patent: 4398013 (1983-08-01), Johnson
patent: 4404355 (1983-09-01), Eldin et al.
patent: 4412048 (1983-10-01), Dixon et al.
patent: 4479990 (1984-10-01), Dixon et al.
patent: 4703338 (1987-10-01), Sagami et al.
patent: 4818776 (1989-04-01), Koleske
patent: 4842800 (1989-06-01), Walles et al.
patent: 4857562 (1989-08-01), Wacker et al.
patent: 4966922 (1990-10-01), Gross et al.

Affiliated with

Also associated with

Rating

Dual cure epoxy backseal formulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual cure epoxy backseal formulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual cure epoxy backseal formulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1860322