Dual composition ceramic substrate for microelectronic...

Details Dual composition ceramic substrate for microelectronic... Dual composition ceramic substrate for microelectronic...

2005-07-19

2005-07-19

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S209000, C428S212000, C428S472200, C174S258000

Reexamination Certificate

active

06919125

ABSTRACT:
Ceramic substrates (1) for microelectronic modules are formed in multiple layers (7&9) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer (9) is optimal in composition for bonding to a thick film conductor (11) and the other outer layer (7) is optimal in composition for bonding to a thin film conductor (13). In a dual composition substrate embodiment one layer is formed of a 96% alumina composition and the second layer is formed of a 99.6% alumina composition.

REFERENCES:
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patent: 4598107 (1986-07-01), Herron et al.
patent: 4655864 (1987-04-01), Rellick
patent: 5300163 (1994-04-01), Ohtaki
patent: 5866240 (1999-02-01), Prabhu et al.
patent: 6017410 (2000-01-01), Baccini
patent: 6531209 (2003-03-01), Polis et al.

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