Dual circuit embossed sheet heat transfer panel

Details Dual circuit embossed sheet heat transfer panel Dual circuit embossed sheet heat transfer panel

1982-08-23

1984-02-21

Cline, William R.

Heat exchange

Three non-communicating fluids

165170, 376146, F28F 312

Patent

active

044324146

ABSTRACT:
A heat transfer panel provides redundant cooling for fusion reactors or the like environment requiring low-mass construction. Redundant cooling is provided by two independent cooling circuits, each circuit consisting of a series of channels joined to inlet and outlet headers. The panel comprises a welded joinder of two full-size and two much smaller partial-size sheets. The first full-size sheet is embossed to form first portions of channels for the first and second circuits, as well as a header for the first circuit. The second full-sized sheet is then laid over and welded to the first full-size sheet. The first and second partial-size sheets are then overlaid on separate portions of the second full-sized sheet, and are welded thereto. The first and second partial-sized sheets are embossed to form inlet and outlet headers, which communicate with channels of the second circuit through apertures formed in the second full-sized sheet.

REFERENCES:
patent: 2950093 (1960-08-01), Krempel
patent: 4243020 (1981-01-01), Mier

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