Dual-chamber fluid pump for a multi-fluid electronics...

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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C165S104330

Reexamination Certificate

active

07841385

ABSTRACT:
A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

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Campbell et al., “Cooling Apparatus, Cooled electronic Module and Methods of Fabrication Thereof Employing a Thermally Conductive Return Manifold Structure Sealed to the Periphery of a Surface to be Cooled”, U.S. Appl. No. 11/420,421, filed May 25, 2006.
Office Action for U.S. Appl. No. 11/426,423 (U.S. Patent Publication No. 2007/0295480 A1), dated Nov. 27, 2009.

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