Drying apparatus and method using IPA of a semiconductor wafer

Details Drying apparatus and method using IPA of a semiconductor wafer Drying apparatus and method using IPA of a semiconductor wafer

1997-11-12

2000-03-07

Bennett, Henry

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

F26B 2106

Patent

active

060323825

ABSTRACT:
When an IPA is fed to a nozzle, a flow of the IPA passing through holes is generated. The flow becomes film-shaped and goes downward along an inner surface of a side wall of a processing vessel. Then, the flow is collected by a liquid receiving section formed in a lower portion of the processing vessel and discharged to an outside. The inner surface of the side wall of the processing vessel is covered with the flow of the IPA. Therefore, an IPA vapor can be prevented from condensing uselessly on the inner surface. As a result, the IPA vapor is effectively utilized for condensation on a surface of the object to be processed which is mounted on a pan. Thus, the defective dryness of the object can be prevented.

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patent: 5369891 (1994-12-01), Kamikawa
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patent: 5535525 (1996-07-01), Gardner
patent: 5539995 (1996-07-01), Bran
patent: 5608974 (1997-03-01), Tanaka et al.
patent: 5657553 (1997-08-01), Tarui et al.
patent: 5671544 (1997-09-01), Yokomizo et al.
patent: 5716458 (1998-02-01), Machino

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