Drying agent and field light emission device using the same

Details Drying agent and field light emission device using the same Drying agent and field light emission device using the same

2011-01-18

2011-01-18

Tarazano, D. Lawrence (Department: 1786)

Stock material or miscellaneous articles

Composite

Of inorganic material

C428S076000, C428S917000, C313S504000, C313S512000, C556S001000, C556S175000, C556S179000, C528S395000

Reexamination Certificate

active

07871712

ABSTRACT:
A water-capturing or drying agent placed in a hermetically sealed field light emission device for maintaining stable light emission of the light emission device not susceptible to moisture and oxygen for long period of time. The drying agent comprises a compound of polymer formed by bonding M constituting a plurality of organometallic compounds wherein M is a trivalent metal atom with an oxygen molecule. The drying agent is placed in the hermetically sealed container, thereby protecting the field light emission device from being adversely affected by damage from trace amounts of moisture permeating from outside the hermetically sealed container and/or adhered to the inner surface thereof.

REFERENCES:
patent: 4514555 (1985-04-01), Taniguchi et al.
patent: 6525339 (2003-02-01), Motomatsu
patent: 6887592 (2005-05-01), Hieda et al.
patent: 7030258 (2006-04-01), Takahashi et al.
patent: 2004/0256592 (2004-12-01), Takahashi et al.
patent: 9-148066 (1997-06-01), None
patent: 2002-33187 (2002-01-01), None
patent: 2002-231443 (2002-08-01), None
patent: 2003-144830 (2003-05-01), None

Affiliated with

Also associated with

Rating

Drying agent and field light emission device using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Drying agent and field light emission device using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Drying agent and field light emission device using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2730558