Dry-wet thermal management system

Drying and gas or vapor contact with solids – Apparatus – For diverse operations on treated material

Reexamination Certificate

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Details

C034S066000, C034S209000, C454S184000, C361S678000, C361S690000, C361S695000, C361S698000

Reexamination Certificate

active

07150109

ABSTRACT:
A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.

REFERENCES:
patent: 3317798 (1967-05-01), Chu et al.
patent: 3406244 (1968-10-01), Oktay
patent: 4399484 (1983-08-01), Mayer
patent: 4493010 (1985-01-01), Morrison et al.
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 4967829 (1990-11-01), Albers et al.
patent: 5057968 (1991-10-01), Morrison
patent: 5177666 (1993-01-01), Bland et al.
patent: 5181648 (1993-01-01), Leicht
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5293754 (1994-03-01), Mizuno
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5718117 (1998-02-01), McDunn et al.
patent: 5740018 (1998-04-01), Rumbut, Jr.
patent: 5831824 (1998-11-01), McDunn et al.
patent: 5854092 (1998-12-01), Root et al.
patent: 5880931 (1999-03-01), Tilton et al.
patent: 5907473 (1999-05-01), Przilas et al.
patent: 5943211 (1999-08-01), Havey et al.
patent: 5999404 (1999-12-01), Hileman
patent: 6055157 (2000-04-01), Bartilson
patent: 6108201 (2000-08-01), Tilton et al.
patent: 6139361 (2000-10-01), Przilas et al.
patent: 6349554 (2002-02-01), Patel et al.
patent: 6392891 (2002-05-01), Tzlil et al.
patent: 6421240 (2002-07-01), Patel
patent: 6496375 (2002-12-01), Patel et al.
patent: 6597569 (2003-07-01), Unrein
patent: 6604370 (2003-08-01), Bash et al.
patent: 6621707 (2003-09-01), Ishimine et al.
patent: 6625023 (2003-09-01), Morrow et al.
patent: 6646879 (2003-11-01), Pautsch
patent: 0 091 733 (1983-10-01), None
patent: 0297308 (1989-01-01), None
patent: 56133544 (1981-10-01), None
patent: 61-267369 (1986-11-01), None
patent: 2-24531 (1990-01-01), None
patent: WO 01/01741 (2001-01-01), None
High-Performance COTS DSP for Harsh Environment VME Electronics, Tilton, Donald E. et al., COTS Journal, May/Jun. 1999.
Mist Cooling for Harsh Environment VME, Tilton, Donald E. et al., RTC Magazine, May 1999.
Applying Mist to COTS Convection Modules Is Really Cool, Tilton, Charles, COTS View, 2000.
Spray Cooling for the 3-D Cube Computer, Tilton, Donald E. et al., InterSociety Conference, May 1994.
Spray Cooling Electrical and Electronic Equipment, Tilton, COTS Journal, Nov. 2003.
Parker Advanced Liquid Cooling Systems Team, Parker Aerospace, May 13, 2003.

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