Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1992-12-22
1995-04-25
Jeffery, John A.
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
219388, 219 851, 228205, C03C 2300, C23G 100, F27B 1100, B23K 120
Patent
active
054095433
ABSTRACT:
A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.
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Jellison James L.
Panitz Janda K. G.
Staley David J.
Jeffery John A.
Libman George H.
Sandia Corporation
Stanley Timothy D.
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