Dry powder deposition apparatus

Details Dry powder deposition apparatus Dry powder deposition apparatus

1998-06-10

2000-05-16

Sells, James

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Electrostatic and/or electromagnetic attraction or...

118624, B05B 5025

Patent

active

060631945

ABSTRACT:
Provided is, among other things, a dry deposition apparatus for depositing grains on a substrate comprising:

REFERENCES:
patent: 1121452 (1914-12-01), Bagnall
patent: 4072129 (1978-02-01), Bright et al.
patent: 4160257 (1979-07-01), Carrish
patent: 4197289 (1980-04-01), Sturzenegger et al.
patent: 4332789 (1982-06-01), Mlodozeniec
patent: 4349531 (1982-09-01), Mlodozeniec et al.
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4561688 (1985-12-01), Tsutsui
patent: 4652318 (1987-03-01), Masuda et al.
patent: 4685620 (1987-08-01), Law et al.
patent: 4779564 (1988-10-01), Kiefer et al.
patent: 4860417 (1989-08-01), Tajima et al.
patent: 4917978 (1990-04-01), Ritt et al.
patent: 4921727 (1990-05-01), Datta et al.
patent: 4921767 (1990-05-01), Datta et al.
patent: 4948497 (1990-08-01), Ohkawa
patent: 4971257 (1990-11-01), Birge
patent: 5028501 (1991-07-01), Ritt et al.
patent: 5080380 (1992-01-01), Nakagawa et al.
patent: 5102690 (1992-04-01), Iyer et al.
patent: 5126165 (1992-06-01), Akihama et al.
patent: 5310582 (1994-05-01), Vyakarnam et al.
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5522131 (1996-06-01), Steger
patent: 5534309 (1996-07-01), Liu
Daviet et al., "Electrostatic Clamping Applied to Semiconductor Plasma Processing-I. Theoretical Modeling," J. Electrochem. Soc., 140(11):3245-3256, Nov. 1993.
Daviet et al., "Electrostatic Clamping Applied to Semiconductor Plasma Processing-II. Experimental Results," J. Electrochem. Soc., 140(11):3256-3261, Nov. 1993.
Field, "Electrostatic wafer clamping for next-generation manufacturing," Solid State Technology, pp. 91-98, Sep., 1994.
Hartsough, "Electrostatic Wafer Holding," Solid State Technology, pp. 87-90, Jan., 1993.
Nakasuji et al., "Low voltage and high speed operating electrostatic wafer chuck using sputtered tantalum oxide membrane," J. Vac. Sci. Technol. A,12(5):2834-2839, Sep./Oct., 1994.
Seanor, "Triboelectrification Of Polymers," in K.C. Frisch and A. Patsis, Electrical Properties of Polymers, Technominc Publications, Westport, CT, pp. 37-58.
Singer, "Electrostatic Chucks in Wafer Processing," Semiconductor International, pp. 57-64, Apr., 1995.
Watanabe et al., "Electrostatic charge distribution in the dielectric layer of alumina electrostatic chuck," Journal of Materials Science, 29:3510-3516, 1994.
Watanabe et al., "Electrostatic Force and Absorption Current of Alumina Electrostatic Chuck," J. Appl. Phys., 31(7):2145-2150, Jul. 1992.

Affiliated with

Also associated with

Rating

Dry powder deposition apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dry powder deposition apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dry powder deposition apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-255406