Dry film resist transport and lamination system for semiconducto

Details Dry film resist transport and lamination system for semiconducto Dry film resist transport and lamination system for semiconducto

1990-12-20

1992-04-21

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

156518, 156519, 156521, 156541, 156542, 156584, B32B 3100

Patent

active

051064502

ABSTRACT:
A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced to a laminating assembly 71 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. The bonded wafer 72 and decal are advanced to a Mylar peeler assembly 82 which strips the transport tape 40 and the Mylar layer 16 away from the wafer 72, thereby leaving a wafer 72 which laminated with dry film photoresist material 18.

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