Dry film resist removal in the presence of electroplated C4's

Details Dry film resist removal in the presence of electroplated C4's Dry film resist removal in the presence of electroplated C4's

1997-09-24

1999-05-18

Soderquist, Arlen

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 1, 134 13, 134 21, 134 37, 134 38, 134 40, 134902, 438745, 438753, B08B3/04

Patent

active

059041560

ABSTRACT:
A process for wet chemically stripping dry, thick film photoresists in semiconductor applications. This process includes contacting the silicon wafer with a stripping solution and agitating the solution. The process may be performed in a strip tank having a chemical stripping solution, and nitrogen or other inert gases may be provided through a pressurized tube to cause bubbling in the solution and to strip the wafer.

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