Dry film photoresist for forming a conformable mask and method o

Details Dry film photoresist for forming a conformable mask and method o Dry film photoresist for forming a conformable mask and method o

1988-10-28

1991-02-12

Dees, Jose

Radiation imagery chemistry: process, composition, or product th

Stripping process or element

Forming nonplanar image

430259, 430319, 430327, 430330, G03C 1112

Patent

active

049923544

ABSTRACT:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.

REFERENCES:
patent: 4127436 (1978-11-01), Friel
patent: 4318975 (1982-03-01), Kuznetsov et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4530896 (1985-07-01), Christensen et al.

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