Dry film multilayer photoresist element

Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Element

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430262, 430263, 430271, 430273, 430281, G03C 178

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active

043189750

ABSTRACT:
A dry film photoresist consisting of a two-layer base incorporating a solid polymeric substrate with a thickness of from 15 to 100.mu. and an intermediate polymeric layer with a thickness of from 3 to 15.mu. transparent to UV-radiation within the range of from 300 to 400 nm, a light-sensitive layer with a thickness of from 4 to 20.mu. and a protective polymeric film with a thickness of from 5 to 50.mu.. All four of these layers are bonded therebetween by adhesion forces so that the adhesion of the protective polymeric film to the light-sensitive layer is less than the cohesion strength of the light-sensitive layer; the adhesion of the solid polymeric substrate to the intermediate polymeric layer is less than the adhesion of the intermediate polymeric layer to the light-sensitive layer and the adhesion force of each of the three above-mentioned layers is less than the cohesion strength of each of said layers.

REFERENCES:
patent: 3661576 (1972-05-01), Crary
patent: 3754920 (1973-08-01), Kuchta
patent: 3873319 (1975-03-01), Berg
patent: 4247619 (1981-01-01), Cohen et al.
patent: 4262080 (1981-04-01), Frosch et al.

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