Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-06-13
1999-06-29
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
H05H 100, H01L 2100
Patent
active
059164115
ABSTRACT:
An etching system for manufacturing a semiconductor device includes: a carbon electrode provided in a reactor chamber; a cooling device for cooling the carbon electrode; a temperature sensor for detecting the temperature of the carbon electrode; a heat-insulator provided in such a manner as to cover the outer peripheral portion of the temperature sensor for preventing the temperature sensor from being thermally affected by a portion other than the carbon electrode; and a controller, connected to the temperature sensor, for controlling the cooling device on the basis of a detection signal outputted from the temperature sensor. This etching system controls the supply amount of carbon from the carbon electrode introduced into plasma for stabilizing an etching process.
REFERENCES:
patent: 4971653 (1990-11-01), Powell et al.
patent: 5155331 (1992-10-01), Horiuchi et al.
patent: 5290381 (1994-03-01), Nozawa et al.
Dang Thi
Kananen Ronald P.
Sony Corporation
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