Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2004-06-11
2010-06-01
Cleveland, Michael (Department: 1792)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
Reexamination Certificate
active
07727412
ABSTRACT:
A dry etching method and the like that can process a layer to be processed in a fine pattern to have a peripheral portion of an angular shape, are described. This dry etching method forms a step portion21along a peripheral portion of a first mask layer20that corresponds to an outline of an etching pattern in such a manner that the step portion21projects toward an opposite side to a magnetic thin layer18(layer to be processed).
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Hattori Kazuhiro
Okawa Shuichi
Takai Mitsuru
Cleveland Michael
Eslami Tabassom Tadayyon
Oliff & Berridg,e PLC
TDK Corporation
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