Dry etching apparatus, etching method, and method of forming...

Details Dry etching apparatus, etching method, and method of forming... Dry etching apparatus, etching method, and method of forming...

2005-08-16

2005-08-16

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C710S063000

Reexamination Certificate

active

06930047

ABSTRACT:
An etching apparatus is provided, in which a plurality of electrodes are disposed for placing a substrate, high-frequency power sources as many as electrodes are provided, and the electrodes and the high-frequency power sources are connected to each other independently. Among a plurality of electrodes, a high-frequency power applied to an electrode disposed below the central portion of the substrate and a high-frequency power applied to electrodes disposed below comer portions of the substrate are controlled respectively, whereby in-plane uniformity of etching can be enhanced.

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El-Kareh, Badih, “Fundamentals of Semiconductor Processing Technologies”, 1998, Kluwer Academic Publishers, third printing, p. 285.

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