Dry etching apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156643, 156646, 20429835, 20429836, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

051085356

ABSTRACT:
A dry etching apparatus includes a discharge room in which a gas plasma is created by a discharge, an ejection nozzle for ejecting the plasma gas, a first vacuum room into which the plasma gas is introduced through the ejecting nozzle by supersonic expansion of the plasma gas, and a second vacuum room including a skimmer for extracting a supersonic molecular flow, the supersonic molecular flow of the plasma gas taken into the second vacuum room being blown against the material to be etched.

REFERENCES:
Suzuki et al., "Anisotropic Etching . . . Beam", Journal of Applied Physics 64 (7), Oct. 1988, pp. 3697-3705.
Geis et al., "Hot-Jet Etching . . . Si", Journal of Vacuum Science Technology B5(1), 1987, pp. 363-365.

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