Dry etching apparatus

Details Dry etching apparatus Dry etching apparatus

1988-05-10

1990-09-11

Nguyen, Nam X.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

20429831, 20429832, 20429833, 20429834, 20429838, B44C 122, H01L 21306, C03C 1500

Patent

active

049560433

ABSTRACT:
A dry etching apparatus is disclosed, in which the temperature of an article to be etched, placed on a wafer table, is controlled by a liquefied gas and a heater and the height of the surface of the liquefied gas can be varied arbitrarily. This apparatus enables the controlling of the temperature of the article to be done with a high accuracy over a wide range of low levels. Therefore, a low-temperature dry etching operation, which cannot otherwise be attained by a conventional apparatus of this kind, can be carried out.

REFERENCES:
patent: 4129478 (1978-12-01), Racine et al.
patent: 4264393 (1981-04-01), Gorin et al.
patent: 4370192 (1983-01-01), Cooley
patent: 4526644 (1985-07-01), Fujiyama et al.
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 4579623 (1986-04-01), Suzuki et al.
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4747928 (1988-05-01), Takahashi et al.
patent: 4756815 (1988-07-01), Turner et al.

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