Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Resist material applied in particulate form or spray
Patent
1998-07-22
2000-08-29
Parker, Fred J.
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
Resist material applied in particulate form or spray
216 49, 216 51, 427475, 427282, B05D 104
Patent
active
061103942
ABSTRACT:
A substrate is placed on a charging surface, to which a first voltage is applied. Etch-resistant dry particles are placed in a cup in a nozzle to which a second voltage, less than the first voltage, is applied. A carrier gas is directed through the nozzle, which projects the dry particles out of the nozzle toward the substrate. The particles pick up a charge from the potential applied to the nozzle and are electrostatically attracted to the substrate. The particles adhere to the substrate, where they form an etch mask. The substrate is etched and the particles are removed. Emitter tips for a field emission display may be formed in the substrate.
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Advanced Display Systems, Inc., Richardson, Texas, "ASDM-05 Automatic Spacer Distributor Machine" No Date.
Thesis by Mark Allen Gilmore, Northeastern University, Boston, Massachusetts, Jul. 30, 1992, "The Application of Field Emitter Arrays to Gaseous Ion Production," pp. 1-107.
Alwan James J.
Cathey David A.
Tjaden Kevin
Micro)n Technology, Inc.
Parker Fred J.
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