Droplet ejection method of forming a film

Details Droplet ejection method of forming a film Droplet ejection method of forming a film

2007-04-03

2007-04-03

Parker, Fred J. (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098400, C427S261000, C427S265000, C427S466000

Reexamination Certificate

active

10310121

ABSTRACT:
A droplet ejection patterning method of ejecting a dispersion formed by dispersing a convectable dispersoid in a dispersion medium onto a substrate including a lyophilic region and a lyophobic region. Due to a concentration difference of the dispersion, the dispersoid convects within the dispersion medium toward the edges of the dispersion to form narrow lines of the dispersoid without using photolithography.

REFERENCES:
patent: 2371153 (1945-03-01), Connelly
patent: 5997136 (1999-12-01), Fujisawa et al.
patent: 6153263 (2000-11-01), Haruta et al.
patent: 6599582 (2003-07-01), Kiguchi et al.
patent: 6599780 (2003-07-01), Morii
patent: 2002/0151161 (2002-10-01), Furusawa
“High Resolution Inkjet Printing of All-Polymer Transistor Circuits”, H. Sirringhaus et al, SCINECE, vol. 290, pp. 2123-2126, Dec. 15, 2000.

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