Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-11-14
2009-12-01
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679520, C361S679530, C361S696000
Reexamination Certificate
active
07626815
ABSTRACT:
The present invention represents a significant advancement in the field of cooling systems for computer hardware. One embodiment of a system for cooling a heat-generating device includes a housing sized to fit within a drive bay of a computing device, a heat exchanger disposed within the housing and configured to transfer heat from liquid to air, a fan disposed within the housing and configured to force air through the heat exchanger, and a pump disposed within the housing and configured to circulate a liquid through a cold plate sub-assembly and back to the heat exchanger. The cold plate sub-assembly is configured to be thermally coupled to the heat-generating device. The disclosed system may be advantageously disposed in any computing device whose chassis has a standard-sized drive bay, thereby enabling the system to be easily implemented across a wide variety of computing devices.
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Summary of Translation of Office Action and Search Report from Taiwan patent office, TW Application Ser. No. 095142155, Apr. 13, 2009 (provided as explanation of relevance of TW 450378).
Gandhi Jayprakash N
Haughton Anthony M
NVIDIA Corporation
Patterson & Sheridan LLP
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