Drill cutting treatment method and apparatus

Details Drill cutting treatment method and apparatus Drill cutting treatment method and apparatus

2005-12-27

2005-12-27

Kreck, John (Department: 3673)

Boring or penetrating the earth

With above-ground means for preparing or separating drilling...

C366S291000

Reexamination Certificate

active

06978851

ABSTRACT:
A method and apparatus for treating for disposal oil-contaminated clay substrates such as drill cuttings from drilling with an oil-based mud. If necessary, the substrate is pretreated with an aqueous emulsion breaker such as alkylbenzenesulfonic acid. The substrate is mixed under high shear conditions with a mineral acid such as sulfuric acid. This can be done in an agitated reactor with sequential addition of the organic and inorganic acids. The substrate is then mixed with alkaline earth such as lime in a second agitated reactor. The reactions between the acid(s), alkaline earth and substrate are exothermic and provide heat to vaporize the oil, reaction products and water. Recoverable constituents in the vapor can be condensed in a vapor collection system. The treated substrate is essentially free of oil and has a controlled water content.

REFERENCES:
patent: 668297 (1901-02-01), Powter
patent: 1002246 (1911-09-01), Ellis
patent: 1809672 (1931-06-01), Wakefield et al.
patent: 1919878 (1933-07-01), Brownlee
patent: 2585701 (1952-02-01), Lavere
patent: 2962114 (1960-11-01), Medearis
patent: 3170868 (1965-02-01), Atkinson
patent: 5236282 (1993-08-01), Teasel et al.
patent: 5344255 (1994-09-01), Toor

Affiliated with

Also associated with

Rating

Drill cutting treatment method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Drill cutting treatment method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Drill cutting treatment method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3504316