Downsized package for electric wave device

Details Downsized package for electric wave device Downsized package for electric wave device

2007-11-06

2007-11-06

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257SE31127, C257SE23061, C257SE23193, C257S728000, C257S688000, C257S774000, C257S773000, C257S700000, C257S701000, C257S703000, C257S758000, C257S778000, C257S776000, C257S414000

Reexamination Certificate

active

11115253

ABSTRACT:
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.

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