Dowel-less mold chase for use in transfer molding

Details Dowel-less mold chase for use in transfer molding Dowel-less mold chase for use in transfer molding

1991-04-01

1991-10-29

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 95, 264272170, 425121, 425183, 425192R, 425195, 425544, 425588, 425DIG228, B29C 4502, B29C 4514, B29C 3330

Patent

active

050611640

ABSTRACT:
Transfer molding equipment, used to encapsulate semiconductor die, is provided with clamps mounted to the mold base to position and align mold chases. Previous designs position and align the top and bottom mold chases using dowels on the mold base received in holes in the chases. The invention reduces the downtime of the mold equipment, and decreases the time required to replace the chases when a different package is to be produced.

REFERENCES:
patent: 3904343 (1975-09-01), Scott, Jr.
patent: 4416604 (1983-11-01), Bender et al.
patent: 4697784 (1987-10-01), Schmid
patent: 4767302 (1988-08-01), Okamoto et al.
patent: 4779835 (1988-10-01), Fukushima et al.
patent: 4793785 (1988-12-01), Osada

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