Double-sided wiring board, manufacturing method of...

Details Double-sided wiring board, manufacturing method of... Double-sided wiring board, manufacturing method of...

2008-08-18

2010-11-02

Levi, Dameon E (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S266000, C361S760000

Reexamination Certificate

active

07825340

ABSTRACT:
In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.

REFERENCES:
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patent: 2004/0078964 (2004-04-01), Itou et al.
patent: 2006/0254808 (2006-11-01), Farnworth et al.
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patent: 2004-281437 (2004-10-01), None
patent: 2004-327645 (2004-11-01), None
patent: 2007-189125 (2007-07-01), None

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