Double sided wafer, alignment technique

Details Double sided wafer, alignment technique Double sided wafer, alignment technique

1994-12-28

1996-06-25

Evans, F. L.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

G01B 1100

Patent

active

055305520

ABSTRACT:
A photolithographed method and pattern for alignment of circuit patterns on double sided opaque substrate or semiconductor such as a silicon wafer during processing of integrated circuits.

REFERENCES:
patent: 4393131 (1983-07-01), Whalin et al.

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