Double-sided programmable interconnect structure

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

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257211, 257530, H01L 2710

Patent

active

061602760

ABSTRACT:
An interconnect structure is centered around a substrate having opposite first and second surfaces. Component contacts allocated to cells in the substrate, are provided over both substrate surfaces. Conductive leads extend over each surface in two different directions. The conductive leads are selectively connected to the component contacts. The interconnect structure includes a capability for programmability electrically connecting, or disconnecting, the conductive leads in a desired manner.

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