Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2011-04-19
2011-04-19
Tran, Thao T. (Department: 1787)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C428S3550RA, C428S3550EN
Reexamination Certificate
active
07927697
ABSTRACT:
The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.
REFERENCES:
patent: 7229683 (2007-06-01), Fischer et al.
patent: 7635516 (2009-12-01), Arimitsu et al.
patent: 2001-40301 (2001-02-01), None
patent: 2001-240817 (2001-09-01), None
European Search Report dated Jul. 4, 2007.
Ando Masahiko
Daigaku Noritsugu
Ikishima Miyoko
Nonaka Takahiro
Oura Masahiro
Nitto Denko Corporation
Sughrue & Mion, PLLC
Tran Thao T.
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