Double sided optical inspection of thin film disks or wafers

Details Double sided optical inspection of thin film disks or wafers Double sided optical inspection of thin film disks or wafers

2007-03-13

2007-03-13

Stafira, Michael P. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237400, C356S237500

Reexamination Certificate

active

11372556

ABSTRACT:
A double-sided optical inspection system is presented which may detect and classify particles, pits and scratches on thin film disks or wafers in a single scan of the surface. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction on both surfaces of the wafer or thin film disk. The scattered light from radial and circumferential beams is separated via their polarization or by the use of a dichroic mirror together with two different laser wavelengths.

REFERENCES:
patent: 6104481 (2000-08-01), Sekine et al.
patent: 6657715 (2003-12-01), Vaez-Iravani et al.

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