Double sided mounting module for surface mount integrated circui

Details Double sided mounting module for surface mount integrated circui Double sided mounting module for surface mount integrated circui

1986-10-01

1988-03-08

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361392, 361395, 361417, H05K 111

Patent

active

047302380

ABSTRACT:
A multiple layer connection system for compactly connecting a plurality of surface mount integrated circuit packages to a printed circuit board is disclosed. A plurality of staggered metal legs is respectively inserted into a plurality of slots formed along an edge of an intermediate plastic sheet. A first outside sheet and a second outside sheet sandwich the intermediate sheet between themselves. The first outside sheet has a plurality of foil conductors formed on an inside layer thereof to connect with a first portion of the staggered legs. A plurality of feed through holes are in electrical connection with the first conductive traces and with a plurality of first outside foil traces which are connectable by soldering to the legs of a surface mount integrated circuit package. A second plurality of inside foil traces is formed on an inside layer of the second plastic sheet and contacts a second group of the legs. A second plurality of feed through holes connects the second plurality of inside foil to a second plurality of outside foil traces formed on an outside layer of the second sheet. A second integrated circuit surface mount device is connectable by soldering to the second plurality of outside conductive traces.

REFERENCES:
patent: 3761858 (1973-09-01), Oka
patent: 3958155 (1976-05-01), Bogholtz et al.
patent: 4434321 (1984-02-01), Betts

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